Grand Opening Keynote

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Date: Wednesday, March 17, 2021  
Time: 12:30-16:30  
Venue: Grand Shanghai Ballroom 1+2, Kerry Hotel Pudong, Shanghai  
Chinese and English Simultaneous Interpretation will be provided
Attendee Registration   Previous Review  
   
The "Grand Opening Keynote" marks the start of SEMICON and FPD China. High-profile industry leaders will give keynote speeches, sharing insights on the global industry landscape, technology trend, and market. It is a golden opportunity to exchange ideas with the top global semiconductor industry leaders.

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Agenda 会议日程:

12:30 – 13:00 Registration 来宾登记
   
13:00 – 13:35
Opening Ceremony and Remarks 开幕典礼及致辞
Lung Chu
President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁、中国区总裁
   
Ajit Manocha (Video)
President & CEO, SEMI
Ajit Manocha, SEMI总裁兼首席执行官
   

Government Official / Leader
政府及上海市领导
   
Ning Wang
President, CECC
王宁,中国电子商会会长
   
Bertrand Loy (Video)
Chairman, SEMI International Board; President and CEO, Entegris
Bertrand Loy, SEMI董事会主席、应特格微电子总裁兼首席执行官
   
Zixue Zhou
Chairman, CSIA
周子学,中国半导体行业协会理事长
   
13:35 –13:50 Video Greeting 视频连线致辞
   

Keynote Session
   
Moderator主持人
Ganming Zhao
Vice President, General Manager Semiconductor China Account Applied Materials; Chief Technology Officer, Applied Materials China
赵甘鸣,  应用材料公司副总裁、半导体中国区事业部总经理; 应用材料中国公司首席技术官
   

Keynote Speakers 主题演讲嘉宾
   
13:50 – 14:15
关于我国芯片制造的一些思考
Hanming Wu
Academician, Chinese Academy of Engineering; Dean, the School of Micro-nano-Electronics, Zhejiang University
吴汉明,中国工程院院士、浙江大学微纳电子学院院长
   
14:15 – 14:40
Shaping future of the mobility together
Thomas Manfred Müller
Executive Vice President, Volkswagen Group China Responsible for Research and Development
Thomas Manfred Müller,大众汽车集团(中国)执行副总裁兼董事、研发部负责人
   
14:40 – 15:05
Automotive Semiconductor Package & Test : Challenges & Opportunities
汽车半导体芯片封测 :挑战与机遇

Li Zheng
Board Member, Chief Executive Officer, JCET
郑力, 长电科技首席执行官、董事
   
15:05 – 15:20
New Collaboration in the New Normal
Scott Meikle
Senior Vice President, Global Customer Operations, Lam Research
Scott Meikle,泛林集团全球客户运营高级副总裁
   
15:20 – 15:45
Advancing Electronics: Moore' s & More Materials -- Speed up the game in the fastest growing market
推进未来电子科技:摩尔定律与材料创“芯”—— 中国半导体市场的星辰大海

Allan Gabor
President, Merck China;Managing Director, Electronics China
Allan Gabor,默克中国总裁兼电子科技中国区董事总经理
   
15:45 – 16:10
Closing Keynote
Common Industry Challenge : Imbalance between Supply and Demand
共同的行业挑战:供需失衡

Nanxiang Chen
Co-president, Unigroup
陈南翔,紫光集团联席总裁
   
16:10 – 16:20
VIP Conclusion Remarks 嘉宾特别总结致辞
Suxin Zhang
President, Shanghai Integrated Circuit Industry Association (SICA)
张素心,上海市集成电路行业协会会长
   

Thank you 致谢结束
   
* Agenda is subject to change 议程变化恕不另行通知